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Junction Temperature Model and Degradation Effect in IGBT Multichip Power Modules

Author:
González Hernando, Fernando; San Sebastián, Jon; García Bediaga, Asier; Arias Pérez de Azpeitia, ManuelUniovi authority; Rujas, A.
Publication date:
2019
Publisher version:
http://dx.doi.org/10.1109/ECCE.2019.8911889
Descripción física:
p. 8911889-2962
Description:

Annual Energy Conversion Congress and Exposition, ECCE (11th. 2019. Baltimore, USA)

URI:
http://hdl.handle.net/10651/55236
ISBN:
9781728103952
DOI:
10.1109/ECCE.2019.8911889
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