| dc.contributor.author | González Hernando, Fernando | |
| dc.contributor.author | Sebastián, J. S. | |
| dc.contributor.author | Arias Pérez de Azpeitia, Manuel | |
| dc.contributor.author | Rujas, A. | |
| dc.date.accessioned | 2019-03-05T13:08:27Z | |
| dc.date.available | 2019-03-05T13:08:27Z | |
| dc.date.issued | 2018 | |
| dc.identifier.isbn | 9789075815283 | |
| dc.identifier.uri | http://hdl.handle.net/10651/50758 | |
| dc.description | European Conference on Power Electronics and Applications, EPE 2018 ECCE Europe (20th, 2018, Riga, Latvia) | |
| dc.format.extent | p. 8515406- | |
| dc.language.iso | eng | |
| dc.relation.ispartof | 2018 20th European Conference on Power Electronics and Applications, EPE 2018 ECCE Europe | |
| dc.rights | © 2018 IEEE | |
| dc.source | Scopus | |
| dc.source.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85057063349&partnerID=40&md5=521cc002ad8282e0b0f37b9756a41a3f | |
| dc.title | Thermal Characterization of Multichip Power Module | |
| dc.type | conference output | spa |
