Equivalent Electrical Model and Software Tool for SPICE-Compatible Thermal Simulations of High-Power Resistors
Publication date:
2014
Publisher version:
Citación:
Ieee Transactions On Components Packaging And Manufacturing Technology, 4(5), p. 859-869 (2014); doi:10.1109/TCPMT.2013.2296622
Descripción física:
p. 859-869
Identificador local:
20142071
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