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Three-dimensional fully interlaced woven microstrip-fed substrate integrated waveguide

dc.contributor.authorAlonso González, Leticia 
dc.contributor.authorVer Hoeye, Samuel Ezechiel 
dc.contributor.authorFernández García, Miguel 
dc.contributor.authorLas Heras Andrés, Fernando Luis 
dc.date.accessioned2018-11-27T08:03:09Z
dc.date.available2018-11-27T08:03:09Z
dc.date.issued2018
dc.identifier.citationProgress in Electromagnetics Research, 163, p. 25-38 (2018); doi:10.2528/PIER18040207
dc.identifier.issn1070-4698
dc.identifier.urihttp://hdl.handle.net/10651/49147
dc.description.sponsorshipThis work has been supported by Gobierno de España TEC2015-72110-EXP, TEC2016-80815-P and FPU14/00016 grant, and by the Gobierno del Principado de Asturias (PCTI)/FEDER-FSE under projects IDI/2016/000372 and IDI/2017/000083
dc.format.extentp. 25-38
dc.language.isoeng
dc.relation.ispartofProgress in Electromagnetics Research
dc.rights© EMW Publishing 2018
dc.sourceScopus
dc.source.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85051441271&partnerID=40&md5=a1c0130970e047dee0ad7b17ed40cf8a
dc.titleThree-dimensional fully interlaced woven microstrip-fed substrate integrated waveguide
dc.typejournal article
dc.identifier.doi10.2528/PIER18040207
dc.accrualPeriodicityhttp://dx.doi.org/10.2528/PIER18040207
dc.relation.projectIDFEDER-FSE/IDI/2016/000372
dc.relation.projectIDTEC2015-72110-EXP
dc.relation.projectIDTEC2016-80815-P
dc.relation.projectIDFPU14/00016
dc.relation.projectIDFEDER-FSE/IDI/2017/000083
dc.rights.accessRightsopen access
dc.type.hasVersionAM


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