Mostrar el registro sencillo del ítem

Influence of PM Coating on PM Magnetization State Estimation Methods Based on Magnetoresistive Effect

dc.contributor.authorFernández Alonso, Daniel 
dc.contributor.authorDíaz Reigosa, David 
dc.contributor.authorGuerrero Muñoz, Juan Manuel 
dc.contributor.authorZhu, Z. Q.
dc.contributor.authorSuárez Álvarez, Carlos Manuel 
dc.contributor.authorBriz del Blanco, Fernando 
dc.date.accessioned2018-10-08T10:23:07Z
dc.date.available2018-10-08T10:23:07Z
dc.date.issued2018
dc.identifier.citationIEEE Transactions On Industry Applications, 54(3), p. 2141-2150 (2018); doi:10.1109/TIA.2018.2797883
dc.identifier.issn0093-9994
dc.identifier.issn1939-9367
dc.identifier.urihttp://hdl.handle.net/10651/48735
dc.description.sponsorshipThis work was supported in part by the Spanish Ministry of Education, Culture, and Sports through the Jose Castillejo Program under Grant PX15/00354, in part by the Spanish Ministry of Economy and Competitiveness under Project MINECO-17-ENE2016-80047-R, and in part by the Regional Ministry of Education, Culture, and Sport of the Principality of Asturias through the Severo Ochoa Program under Grant BP-13067.
dc.format.extentp. 2141-2150
dc.language.isoeng
dc.relation.ispartofIEEE Transactions On Industry Applications, 54
dc.rights© 2018 IEEE
dc.rightsCC Reconocimiento - No comercial - Sin Obra Derivada 4.0 Internacional
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceWOS:000433089200020
dc.titleInfluence of PM Coating on PM Magnetization State Estimation Methods Based on Magnetoresistive Effect
dc.typejournal article
dc.identifier.doi10.1109/TIA.2018.2797883
dc.relation.projectIDMEC/PX15/00354
dc.relation.projectIDMINECO-17-ENE2016-80047-R
dc.relation.projectIDSevero Ochoa Grant/BP-13067
dc.relation.publisherversionhttp://dx.doi.org/10.1109/TIA.2018.2797883
dc.rights.accessRightsopen access
dc.type.hasVersionAM


Ficheros en el ítem

untranslated

Este ítem aparece en la(s) siguiente(s) colección(ones)

Mostrar el registro sencillo del ítem

© 2018 IEEE
Este ítem está sujeto a una licencia Creative Commons